| |
R5
Rubber Tips…
for optimum processing of bumped die
Picking up die with solder balls or bumps can result in defects,
vacuum loss or other difficulties. Our new R5 series rubber tip with ultra-thin
walls allows for pick-up on the chip surface without vacuum loss or contact with
the balls.
Design Specifications
Standard design specifications
provide for a wall or contact area of 0.10mm (0.004"). In most cases, the
tips are custom-made to a specific die size (X x Y ). A limited number of standard
or open-tooling sizes are available as indicated. Material
Specifications
Hardness :79 Shore A
Heat resistance :130 deg. C
Static dissipation :0.01 to 0.03 sec.
Ionic purity :less than 10
ppm Static
dissipation measured as time to dissipate a charge from +/-5000 V. Ionic purity
measured by boiling rubber in DI water and analyzing the water extract for fluoride,
chloride, potassium, nitrate, phosphate, sulphate, sodium and silicon. |
| No. |
Part
No. | X
Inch | X
mm | Y
Inch | Y
mm | T
Inch | T
mm | H
Inch | H
mm | Holder |
|
1 |
| .123 |
3.12 |
.123 |
3.12 |
.004 |
0.10 |
.016 |
0.40 |
12U3 |
| 2 |
| .063 |
1.60 |
.063 |
1.60 |
.004 |
0.10 |
.016 |
0.40 |
12U3 |
| 3 |
| .094 |
2.40 |
.063 |
1.60 |
.004 |
0.10 |
.016 |
0.40 |
12U3 |
| 4 |
| .402 |
10.20 |
.402 |
10.20 |
.004 |
0.10 |
.008 |
0.20 |
12C3 |
Packing: 20 pieces per vial. |
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