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Pick-up - Rubber Tips (Integrated Circuits)

Replaceable-Rubber Tip (R5 Series)

R5 Rubber Tips… for optimum processing of bumped die

Picking up die with solder balls or bumps can result in defects, vacuum loss or other difficulties. Our new R5 series rubber tip with ultra-thin walls allows for pick-up on the chip surface without vacuum loss or contact with the balls.

Design Specifications

Standard design specifications provide for a wall or contact area of 0.10mm (0.004"). In most cases, the tips are custom-made to a specific die size (X x Y ). A limited number of standard or open-tooling sizes are available as indicated.

Material Specifications
Hardness            : 79 Shore A
Heat resistance   : 130 deg. C
Static dissipation : 0.01 to 0.03 sec.
Ionic purity          : less than 10 ppm

Static dissipation measured as time to dissipate a charge from +/-5000 V. Ionic purity measured by boiling rubber in DI water and analyzing the water extract for fluoride, chloride, potassium, nitrate, phosphate, sulphate, sodium and silicon.

No. Part No. X Inch X mm Y Inch Y mm T Inch T mm H Inch H mm Holder
1 R5-01-021-049 .049 1.25 .021 0.55 .004 0.10 .012 0.30 12U3
2 R5-01-036-052 .036 0.92 .052 1.31 .004 0.10 .010 0.25 12U3
3 R5-01-036-053 .038 0.96 .053 1.34 .004 0.10 .012 0.30 12U3
4 R5-01-063-063 .063 1.60 .063 1.60 .004 0.10 .016 0.40 12U3
5 R5-01-094-063 .094 2.40 .063 1.60 .004 0.10 .016 0.40 12U3
6 R5-01-123-123 .123 3.12 .123 3.12 .004 0.10 .016 0.40 12U3

Packing: 20 pieces per vial.