for optimum processing of bumped die
Picking up die with solder balls or bumps can result in defects, vacuum loss or other difficulties. Our new R5 series rubber tip with ultra-thin walls allows for pick-up on the chip surface without vacuum loss or contact with the balls.
Standard design specifications provide for a wall or contact area of 0.10mm (0.004″). In most cases, the tips are custom-made to a specific die size (X x Y ). A limited number of standard or open-tooling sizes are available as indicated.
Hardness: 79 Shore A
Heat resistance: 130 deg. C
Static dissipation : 0.01 to 0.03 sec.
Ionic purity: less than 10 ppm
Static dissipation measured as time to dissipate a charge from +/-5000 V. Ionic purity measured by boiling rubber in DI water and analyzing the water extract for fluoride, bromide, chloride, potassium, nitrate, phosphate, sulphate, sodium and silicon.
|No.||Part No.||X Inch||X mm||Y Inch||Y mm||T Inch||T mm||H Inch||H mm||Holder|
Packing: 20 pieces per vial.